The use of low-pressure injection molding process to encapsulate PCBs is a new process that has been gradually popularized in recent years with great development advantages. The use of low-pressure injection molding PCB packaging, is the PCB around the injection of PA polyamide material (low-pressure injection molding), rapid curing molding, so as to complete the PCB packaging.
Advantages of PCB low pressure injection molding package:
Low-pressure injection molding process has been very common in foreign countries, the introduction of low-pressure injection molding process into the production of printed circuit boards in the field of encapsulation, so that the printed circuit board can be effectively protected and improve the physical resistance. For example, using low-pressure injection molding process to deal with the PCB of dynamic password token, so that the entire internal hardware of the dynamic password token is not easy to be damaged and stolen, so that the stability and security of the hardware of the dynamic password token can be guaranteed.
-Low injection pressure (1.5~40Bar), which will not damage the PCB components and improve the product yield;
-Injection temperature is relatively low, when the low-pressure injection molding materials hot melt to reach the PCB, the temperature has not damaged the PCB board components;
-Fast curing speed, low-pressure injection molding process for a few seconds ~ dozens of seconds can be quickly cured, greatly improving production efficiency;
-High waterproof sealing performance, protection level IP67 or more;
-Insulation, temperature resistance, shock absorption, high and low temperature resistance, aging resistance and other performance is superior;
-Part of the PCB package, low-pressure injection molding process can replace the traditional potting process required for the shell, saving resources.
Steps for encapsulating PCBs with low-pressure injection molding technology:
1) Put the polyamide material into the glue pool of the low-pressure injection molding machine;
2) Putting the PCB to be processed into the mold corresponding to that PCB;
3) Placing the PCB described in step 2) together with the mold on the operation table of the low pressure injection molding machine;
4) Starting the low-pressure injection molding machine and injecting liquid polyamide material (low-pressure injection adhesive) into the mold under low-pressure condition to fill the space around the PCB and complete the low-pressure injection operation;
5) Fast curing, complete PCB packaging;
6) If the PCB requires a casing, the low pressure injection molding processed PCB is loaded into the casing corresponding to said PCB to complete the encapsulation.
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